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SIPO aims to introduce international professionals in smart electronics industry and improve Taiwan’s technical capability. To assist Taiwan companies to enhance R&D capacity and fulfill HR demand, SIPO set up the Overseas Professionals database, which collecting international talents information and transfer to related companies.

Contact:Serena Lee(TEL:+886-2-2706-9258 ext.34;Email:This email address is being protected from spambots. You need JavaScript enabled to view it.

  • Welcome to download complete resume form ( link )
  • The New Southbound Talent Development for the Semiconductor Industry Project DM file ( link ). Welcome to download.

Realtek Semiconductor Corp. - Senior Design Verification Engineer

IC Design
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Design Verification Engineer
【Job Specification】
  1. Responsibility for test plans, test bench documentation and implementation.
  2. Use System Verilog language, SVA and UVM methodology for block and top level verification.
  3. Apply formal property checking/formal verification methodologies
  4. Understanding of the fundamentals of computer architecture
Date:2019/08/22

Realtek Semiconductor Corp. - Senior Software Design Engineer

IC Design
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Software Design Engineer
【Job Specification】
  1. Wireless AP / Embedded System software development.
  2. Router protocol / Wi-Fi related development.
  3. Embedded system development
  4. FPGA Board for high speed signal integration and verification
  5. Customer Support
Date:2019/08/22

Realtek Semiconductor Corp. - Senior Physical Design/APR Engineer

IC Design
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Physical Design / APR Engineer
【Job Specification】
  1. Work with Digital Design team for Physical Design of SoC chips including top level floor planning, block partition, timing budgeting, power planning, block integration, whole chip timing closure, and tape out
  2. Responsible for physical design methodology research and development
  3. Cross site projects coordination and management
Date:2019/08/22

Realtek Semiconductor Corp. - Senior Digital IC Design Engineer

IC Design
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Digital IC Design Engineer
【Job Specification】
  1. Verilog RTL design implementation
  2. SoC System FPGA verification and debug
  3. Synthesis, LEC, STA, DFT, and SoC integration
  4. This includes but not limited to, logic design, RTL coding, test bench writing, RTL/gate-level simulation/verification and code coverage
Date:2019/08/22

Realtek Semiconductor Corp. - Senior Analog IC Design Engineer

IC Design
【Company Name】
Realtek Semiconductor Corp.
【Job Position】
Senior Analog IC Design Engineer
【Job Specification】
  1. Analog Circuits design for drivers and transceiver
  2. Analog IP development
  3. Power Management design
Date:2019/08/22

Winbond Electronics Corp. - NAND Flash Product (Test) Engineer

IC Fabrication
【Company Name】
Winbond Electronics Corp.
【Job Position】
NAND Flash Product (Test) Engineer
【Job Specification】

With NAND Flash product engineering experience (at least 1 generation PE experience for process development), and 10+ year of product engineering career with strong hands-on bench testing

Date:2019/08/22

Winbond Electronics Corp. - NAND Flash Process Integration Engineer

IC Fabrication
【Company Name】
Winbond Electronics Corp.
【Job Position】
NAND Flash Process Integration Engineer
【Job Specification】

NAND Flash technology development

Date:2019/08/22

Winbond Electronics Corp. - NAND Flash Process Module Engineer

IC Fabrication
【Company Name】
Winbond Electronics Corp.
【Job Position】
NAND Flash Process Module Engineer
【Job Specification】
  • NAND Flash technology development
    1. Hot Process (Furnace & RTP), LPCVD, ALD, Wet for advance NOR, 2xnm beyond NAND flash development.
    2. NAND Flash W gate & Air-Gap development.
    3. The research experience of CoSi/NiSi material.
    4. CVD gap fill and step coverage process control.
    5. RRAM TMO new material development.
Date:2019/08/22

Winbond Electronics Corp. - DRAM Product (Test) Engineer

IC Fabrication
【Company Name】
Winbond Electronics Corp.
【Job Position】
DRAM Product (Test) Engineer
【Job Specification】

Evaluation, validation, probe test, yield/quality improvement or failure analysis of DRAMs

Date:2019/08/22

Walton Advanced Engineering, Inc. - Quality Assurance Engineer

IC Packaging and Testing
【Company Name】
Walton Advanced Engineering, Inc.
【Job Position】
Quality Assurance Engineer
【Job Specification】
  1. Track and complete customer qualifications
  2. Solve customer complaint problems
  3. Responsible for coordinating with other departments when necessary
Date:2018/04/13
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