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SIPO aims to introduce international professionals in smart electronics industry and improve Taiwan’s technical capability. To assist Taiwan companies to enhance R&D capacity and fulfill HR demand, SIPO set up the Overseas Professionals database, which collecting international talents information and transfer to related companies.

Contact:Serena Lee(TEL:+886-2-2706-9258 ext.34;Email:This email address is being protected from spambots. You need JavaScript enabled to view it.

  • Welcome to download complete resume form ( link )
  • The New Southbound Talent Development for the Semiconductor Industry Project DM file ( link ). Welcome to download.

Siliconware Precision Industries - Process Engineer

IC Packaging and Testing
【Company Name】
Siliconware Precision Industries
【Job Position】
Process Engineer
【Job Specification】
  1. Responsible in executing projects verification and data gathering, and using process statistics analysis related methods to generate verified data.
  2. Execute the first setting files for engineering lots (process, machine parameters and quality confirmation; engineering lots process data collection ex: profile , X-Ray ,SAT…etc)
  3. Handle irregularity process material, execute status and data analysis and action plan.
Date:2018/02/23

Siliconware Precision Industries - Product Integration Engineer

IC Packaging and Testing
【Company Name】
Siliconware Precision Industries
【Job Position】
Product Integration Engineer
【Job Specification】
  1. New tool, product and material introduction, execution of process corrective action plans to make new products, new process or new materials to be introduced to the production line speedily, then go into producting.
  2. Execute and coordinate NPI/NP introduction activities.
  3. To draw up Qual plan, monitor Qual lot execution/results.
  4. Customer’s SPEC Review.
  5. Execute ECM changes/set up PDM.
Date:2018/02/23

Micron Technology, Inc. - Parametric and Wafer Level Reliability Engineer

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
Parametric and Wafer Level Reliability Engineer
【Job Specification】
  1. Test program/methodology development and implementation
  2. Multiple test platform application debug, correlation, and monitoring at key electrical wafer processing test points
  3. Perform established and innovative data analysis utilizing processing and test data – publish and present findings as appropriate
  4. Parametric Automated Test Equipment system administration
  5. Statistical Process Control implementation and monitoring
  6. Perform device characterization for design and process verification, and yield learning
  7. Assist in identification and finding resolution to yield and quality issues throughout product lifecycle
  8. Work closely with variety of Production and Engineering groups – Product, Process, Integration, Yield Enhancement, Real-Time Defect Analysis, Quality Reliability Assurance and other Probe groups
Date:2018/02/23

Micron Technology, Inc. - Wafer Test Program Developer

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
Wafer Test Program Developer
【Job Specification】
  1. Develop and maintain wafer level test program for memory devices.
  2. Constantly learn new device specifications and operations in order to develop cost effective and innovative solutions for production test flows thru test algo optimization.
  3. Support production teams by helping determine software or hardware issues with the testers and participate as an integral part of disposition of lots and providing off hours support.
Date:2018/02/23

Micron Technology, Inc. - Probe Process and Software Engineer

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
Probe Process and Software Engineer
【Job Specification】
  1. Ensure the smooth running of the production line of the Probe floor by managing the setup of Micron Probe automation systems and disposition.
  2. Be responsible for defining and streamlining business processes, or develop new software solutions to improve overall fab efficiency.
  3. Work with cross-functional team on the problem solving, and participate in global projects and alignment meetings.
Date:2018/02/23

Micron Technology, Inc. - Equipment Support Technician

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
Equipment Support Technician
【Job Specification】
  1. Support, repair and upgrade production equipment
  2. Perform PM (Preventive Maintenance) and Change Over on production equipment effectively and efficiently
  3. Assist Supervisors/Engineers in making quality and reliability improvements
  4. Troubleshoot and analyze machine failure mechanism or frequency
  5. Minimize equipment downtime through preventive maintenance / fixes
  6. Monitor and improve on repair cycle time through continuous improvement effort
  7. Involved in Empowerment & Autonomous Maintenance Team activities
Date:2018/02/23

Micron Technology, Inc. - Test Equipment Engineer

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
Test Equipment Engineer
【Job Specification】
  1. Responsible for the performance of a group of highly automated and computerized production equipment.
  2. Support manufacturing production and ensure smooth operation.
  3. Introduce and recommend improvement programs / activities and upgrade equipment to meet production and new product requirements.
  4. Participate in Global forums and drive alignment, issues resolution and BKM (Best Known Methods)
  5. Install and qualify new equipment
  6. Performance Management and Development for directs
Date:2018/02/23

Micron Technology, Inc. - DRAM Product Test Development Engineer

IC Fabrication
【Company Name】
Micron Technology, Inc.
【Job Position】
DRAM Product Test Development Engineer
【Job Specification】
  1. Develop, debug, and maintain code that enables the massive parallel testing of advanced semiconductor devices.
  2. Support R&D, interacting closely with Product Engineering, as well as taking part in the designing and debugging of test hardware.
  3. Be expected to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets.
  4. Responsibilities also include but are not limited to: analyzing device yield and testing issues, developing and implementing functionality monitors, and developing and proving methods to reduce test time while maintaining test completeness.
  5. Be expected to interface with outside engineering groups to accomplish these roles.
Date:2018/02/23

Phison Electronics Corps. - Analog IC Design Engineer

IC Design
【Company Name】
Phison Electronics Corps.
【Job Position】
Analog IC Design Engineer
【Job Specification】
  1. Be part of the growing IC design team developing high speed analog & mixed-signal integrated circuits up to 32Gbps for serial-link applications.
  2. Be responsible for schematic design through layout, verification and IC characterization.
  3. Have experience in designing at least one of the following key functions: CDR(Clock and Data Recovery), PLLs, Transmitters, Receivers, Adaptive Equalizer
Date:2018/02/23

Holtek Semiconductor Inc. - FAE(Field Application Engineer)

IC Design
【Company Name】
Holtek Semiconductor Inc.
【Job Position】
FAE(Field Application Engineer)
【Job Specification】
  1. Supporting customers / troubleshooting at customers’s place
  2. Willing to travel across India.
Date:2018/02/23
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