產業新訊
Winbond Electronics Corp. - NAND Flash Product (Test) Engineer
IC製造
【Company Name】
Winbond Electronics Corp.
Winbond Electronics Corp.
【Job Position】
NAND Flash Product (Test) Engineer
NAND Flash Product (Test) Engineer
【Job Specification】
With NAND Flash product engineering experience (at least 1 generation PE experience for process development), and 10+ year of product engineering career with strong hands-on bench testing
【Job Requirements】
- Prefer to be willing to work in Taiwan; this is negotiable for outstanding candidates.
- Expected onboarding date: 2019/Q4
- 10+ year of product engineering career with strong hands-on bench testing
【Job Location】
Hsinchu, Taiwan
Hsinchu, Taiwan
Date：2019/08/22